We are excited to introduce the  E300 Series , a family of  small-footprint  modular industrial PCs. The E300 Series delivers powerful computing in a compact form factor, offering rich I/O and expansion capabilities to meet diverse application needs…

Meet the E300 Series: Small Footprint Modular Industrial PC Solutions with Rich I/O and Expansion Options

We are excited to introduce the E300 Series, a family of small-footprint modular industrial PCs. The E300 Series delivers powerful computing in a compact form factor, offering rich I/O and expansion capabilities to meet diverse application needs.

Built around Intel’s 12th–14th Gen LGA1700 processors and an Intel Q670E chipset, these IPC solutions combine desktop-class performance with industrial reliability.

The E300 Series adopts a modular design that allows multiple configurations through different chassis sizes and expansion boards – enabling a high degree of flexibility.

Whether you need a ultra-compact system or an extended chassis with add-ons, the E300 can be tailored accordingly. Below, we highlight key features and options available in the E300 Series.

Key Highlights of the E300 Series

  • Compact Fanless Design – 153 × 250 × 48 mm for standard fanless models, suitable for demanding environments, without sacrificing performance.
  • Enhanced Active Cooling – Supporting high TDP processors with redesigned heatsink and dual centrifugal fans. Desktop-class performance for industrial applications.
  • Modular Design – Flexible configurations with rich IO, connectivity, and expansion options.
  • Customizable for Your Projects – Tailored customization service available, even for small order quantities.

Compact Fanless Design

E300 Series Fanless Design

We have redesigned the chassis to be more compact, with just 48mm in height for the standard E300F models.

This slim profile allows the E300 Series to fit into tight spaces while still providing robust performance. The fanless design ensures silent operation and reduces maintenance requirements.

Enhanced Active Cooling

E300 Series Active Cooling

The redesigned E300 Series chassis also supports active cooling with dual centrifugal fans.

With active cooling, the E300 can handle higher TDP processors, bringing desktop-class performance to industrial applications.

Modular Design

The E300 Series adopts a modular design that allows for flexible configurations. You can choose from different extension options to suit your specific needs, including:

  • Ethernet Expansion – Add up to 4 × 2.5Gb Ethernet ports.
  • Storage Expansion – Add up to 4 × M.2 slots for PCIe SSDs.
    • 5 × M.2 M-Key 2280 slots for PCIe SSDs on E300X and E300XF
  • Wireless Expansion – Add M.2 slots for Wi-Fi/Bluetooth modules
  • Cellular Expansion – Add M.2 slots for 5G/4G/LTE modules.
  • PCIe Card Expansion – Add PCIe slots for additional functionality.

Customizable for Your Projects

In addition to our standard configurations, King Young offers comprehensive OEM and ODM services.

We can customize hardware specifications, branding and I/O requirements to align with your project goals.

Our engineering and manufacturing teams collaborate closely with partners to deliver tailored industrial PC solutions. And our highly modular design makes it easy to adapt at a lower cost, and smaller minimum order quantities.

Contact us to discuss how the E300 Series can be customized for your brand and application.

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